wettable nozzle for selective soldering machine

A few pin in print circuit board if use wave soldering to do soldering that will be spend more money which concern solder consumtion , flux consumption
Today have a machine can be done soldering by using a small nozzle that call"wettable nozzle"
Meaning of wettable nozzle is liquid solder is cover around nozzle surface that it can be focus arrea to do soldering without solder splash.

Solder Hairline short between PTH component

Many PCBA that have a very narrow pin less than 20 mils pitch (pad to pad)is be faced
hairline (very small dross) short problem that difficult to visual inspection after post wave.
The way for solving this problem
1.Good perform to do maintainance (cleanning flowduct by monthly)will be decreased this problem 90%
2.Addition camera for inspection

Kaizen Meaning

Kaizen is a culture of sustained continuous improvement focusing on eliminating waste in all systems and processes of an organization

KAI=To break apart,To modify,To change
ZEN=Think,Make good,Make better
KAIZEN=Change for better Continuous Improvement

Overall Equipment Effectiveness(OEE)

Overall Equipment Effectiveness(OEE)
Overall Equipment Effectiveness is the industry standard for measuring the effectiveness of equipment .It is more than just a traditional measure of efficiency.It include of
1.Availability: a comparison of the potential operation time with actual time the equipment is producing products.
2. Performance:a comparison of the actual output and what the equipment can produce.
3.Quality:a comparison of the number of products produced and the number of products that meet the customers expectation
The formula to find the OEE is
OEE=(Availability)X(Performance)X(Quality)

Solder skip from seletive pallet

Pb-Free or lead free solder will be faced the solder skip if the pallet open too small

Solder tension during remove the connector

Solder tension is coming out from the center of solder fountain nozzle will direcly force the copper pad that always found the copper dissolution problem in lead free solder.This problem will be reduced by put the screen in the center of nozzle .It will reduce force and reduce the copper dissolution.

How to get the Profile

Thermal profile is gotten from the data logger

1.Puting the board profile on the machine carrier

2.plug the thermocouple to thermal profiler

3.Open the reflow program(doing via the SRT solfware 1-2-3-go)

4.Completed cycle then loading the graph from thermal profiler

5.Analyse that profile graph if it cannot achive the target ,parameter need to adjust.